JPH0549624B2 - - Google Patents

Info

Publication number
JPH0549624B2
JPH0549624B2 JP58034378A JP3437883A JPH0549624B2 JP H0549624 B2 JPH0549624 B2 JP H0549624B2 JP 58034378 A JP58034378 A JP 58034378A JP 3437883 A JP3437883 A JP 3437883A JP H0549624 B2 JPH0549624 B2 JP H0549624B2
Authority
JP
Japan
Prior art keywords
melting point
parts
ceramic
glass
low melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58034378A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59162169A (ja
Inventor
Nobuyuki Ushifusa
Satoru Ogiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58034378A priority Critical patent/JPS59162169A/ja
Publication of JPS59162169A publication Critical patent/JPS59162169A/ja
Publication of JPH0549624B2 publication Critical patent/JPH0549624B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676Single layer compositions

Landscapes

  • Compositions Of Oxide Ceramics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP58034378A 1983-03-04 1983-03-04 セラミック多層配線板 Granted JPS59162169A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58034378A JPS59162169A (ja) 1983-03-04 1983-03-04 セラミック多層配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58034378A JPS59162169A (ja) 1983-03-04 1983-03-04 セラミック多層配線板

Publications (2)

Publication Number Publication Date
JPS59162169A JPS59162169A (ja) 1984-09-13
JPH0549624B2 true JPH0549624B2 (en]) 1993-07-26

Family

ID=12412504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58034378A Granted JPS59162169A (ja) 1983-03-04 1983-03-04 セラミック多層配線板

Country Status (1)

Country Link
JP (1) JPS59162169A (en])

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61274399A (ja) * 1985-05-29 1986-12-04 株式会社ノリタケカンパニーリミテド 多層セラミック基板用組成物および多層セラミック基板の製造方法
JPS6247196A (ja) * 1985-08-26 1987-02-28 松下電器産業株式会社 セラミツク多層基板
JPH084194B2 (ja) * 1987-06-23 1996-01-17 株式会社住友金属セラミックス セラミックス多層回路基板の製造方法
JP3067919B2 (ja) * 1992-12-28 2000-07-24 太陽誘電株式会社 高周波用低温焼結性磁器組成物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5361607A (en) * 1976-11-15 1978-06-02 Matsushita Electric Works Ltd Process for making inorganic sintered object
JPS5817651A (ja) * 1981-07-24 1983-02-01 Hitachi Ltd 多層回路板とその製造方法

Also Published As

Publication number Publication date
JPS59162169A (ja) 1984-09-13

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